The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2018
Filed:
Oct. 28, 2016
Fuji Electric Co., Ltd., Kanagawa, JP;
Toshio Denta, Matsumoto, JP;
FUJI ELECTRIC CO., LTD., Kanagawa, JP;
Abstract
Provided is a semiconductor device including an insulating substrate on which a semiconductor chip is mounted and a case that is adhered to the insulating substrate. The case includes a recess portion that is provided with an adhesive agent and into which a front surface side of the insulating substrate is inserted. The insulating substrate includes, in a side surface along a thickness direction, a front-side notched portion formed on the front surface side and a back-side notched portion formed on a back surface side. Length from a peak located between the front-side notched portion and the back-side notched portion to the front surface in the thickness direction is greater than or equal to 30% of an less than or equal to 70% of length of the recess portion of the case in the thickness direction.