The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2018
Filed:
Dec. 09, 2011
SE Ra Kim, Daejeon, KR;
Hyo Sook Joo, Daejeon, KR;
Suk KY Chang, Daejeon, KR;
Jung Sup Shim, Daejeon, KR;
Se Ra Kim, Daejeon, KR;
Hyo Sook Joo, Daejeon, KR;
Suk Ky Chang, Daejeon, KR;
Jung Sup Shim, Daejeon, KR;
LG Chem, Ltd., Seoul, KR;
Abstract
Provided is a substrate for processing a wafer. The present invention can provide a substrate having excellent heat resistance and dimensional stability. The present invention can provide a substrate that has excellent stress relaxation properties, and therefore can prevent a wafer from being destroyed due to residual stress. Also, the present invention can provide a substrate that can prevent a wafer from being damaged or fried off due to a non-uniformly applied pressure during the wafer processing process, and that exhibits excellent cuttability. For these reasons, the substrate can be useful as a sheet for processing a wafer in various wafer preparation processes such as dicing, back-grinding, and picking-up.