The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2018
Filed:
May. 31, 2017
Fuji Electric Co., Ltd., Kanagawa, JP;
Shinya Takashima, Hachioji, JP;
Katsunori Ueno, Matsumoto, JP;
Masaharu Edo, Tokorozawa, JP;
Akira Uedono, Tsukuba, JP;
FUJI ELECTRIC CO., LTD., Kanagawa, JP;
Abstract
An ion implantation results in defects generated in a nitride semiconductor layer. If the nitride semiconductor layer is set at a particular temperature for a predetermined time period after the ion implantation, the defects may probably be clustering. Provided is a manufacturing method of a semiconductor device including a nitride semiconductor layer comprising: implanting impurities in the nitride semiconductor layer; and increasing a temperature of the nitride semiconductor layer from an initial temperature to a target temperature and annealing the nitride semiconductor layer at the target temperature for a predetermined time period; wherein in the annealing, in at least part of temperature regions below a first temperature between the initial temperature and the target temperature, the nitride semiconductor layer is annealed at a temperature increase speed lower than in a temperature region not lower than the first temperature.