The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2018

Filed:

Jul. 15, 2015
Applicant:

Nantong Memtech Technologies Co., Ltd., Nantong, Jiangsu, CN;

Inventors:

Huisheng Han, Jiangsu, CN;

Zhenxing Wang, Jiangsu, CN;

Yang Ding, Jiangsu, CN;

Hongmei Zhang, Jiangsu, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01H 1/021 (2006.01); H01H 11/04 (2006.01); H01H 11/06 (2006.01); C23C 18/16 (2006.01); C23C 18/18 (2006.01); C23C 18/36 (2006.01); C23C 18/50 (2006.01); C23C 18/52 (2006.01); C23C 18/48 (2006.01); C25D 3/14 (2006.01); C25D 3/56 (2006.01); C25D 7/00 (2006.01);
U.S. Cl.
CPC ...
H01H 1/021 (2013.01); C23C 18/1633 (2013.01); C23C 18/1692 (2013.01); C23C 18/1806 (2013.01); C23C 18/1844 (2013.01); C23C 18/36 (2013.01); C23C 18/48 (2013.01); C23C 18/50 (2013.01); C23C 18/52 (2013.01); C25D 3/14 (2013.01); C25D 3/562 (2013.01); C25D 7/00 (2013.01); H01H 11/041 (2013.01); H01H 11/06 (2013.01); H01H 2011/046 (2013.01);
Abstract

An arc-ablation resistant switch contact and a preparation method thereof is disclosed. The switch contact is a complex having a plurality of layers of layered structure, wherein a first layer is a hydrophobic rubber layer, a second layer is an adhesive layer, a third layer is a sheet metal layer, a fourth layer is an adhesive layer, and a fifth layer is a metal plated layer; wherein, the fifth layer of metal plated layer is formed by dipping a complex of the first layer, the second layer, the third layer and the fourth layer in a chemical plating bath containing refractory metal elements, and depositing on surfaces of the second layer, the third layer and the fourth layer in the complex by a chemical deposition method.


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