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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9905328 B1

PDFFull Text
Date of Patent:
Feb. 27, 2018

Filed:

Jun. 02, 2014

Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the same

Applicant:

Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;

Inventors:

Keiichi Hasebe, Tokyo, JP;

Naoki Kashima, Tokyo, JP;

Takenori Takiguchi, Tokyo, JP;

Takaaki Ogashiwa, Yamagata, JP;

Assignee:

MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Marc S Zimmer

Int. Cl.
CPC ...
C08L 63/00 (2006.01); B32B 15/04 (2006.01); B32B 27/38 (2006.01); H01B 3/40 (2006.01); C08J 5/24 (2006.01); B32B 5/26 (2006.01); C08J 5/04 (2006.01); C08K 3/00 (2018.01); C08K 5/3415 (2006.01); C08K 5/544 (2006.01); B32B 27/12 (2006.01); B32B 27/20 (2006.01); B32B 27/28 (2006.01); B32B 27/34 (2006.01); B32B 15/14 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H01B 3/40 (2013.01); B32B 5/26 (2013.01); B32B 15/04 (2013.01); B32B 15/14 (2013.01); B32B 27/12 (2013.01); B32B 27/20 (2013.01); B32B 27/281 (2013.01); B32B 27/34 (2013.01); B32B 27/38 (2013.01); C08J 5/043 (2013.01); C08J 5/24 (2013.01); C08K 3/0033 (2013.01); C08K 5/3415 (2013.01); C08K 5/5442 (2013.01); H05K 1/02 (2013.01); B32B 2255/26 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2264/10 (2013.01); B32B 2264/102 (2013.01); B32B 2307/304 (2013.01); B32B 2307/306 (2013.01); B32B 2457/08 (2013.01); C08J 2363/02 (2013.01); H05K 1/0373 (2013.01);
Abstract

A resin composition used as a material of an insulating layer of a printed wiring board including the insulating layer and a conductor layer formed on a surface of the insulating layer by plating, the resin composition including: an epoxy compound; a cyanate compound; a maleimide compound; an inorganic filler; and an imidazole silane, wherein the maleimide compound includes a predetermined maleimide compound, a content of the maleimide compound is 25% by mass or less based on 100% by mass of a total content of the epoxy compound, the cyanate compound, and the maleimide compound, and the imidazole silane includes a compound represented by the formula (3).

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