The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2018

Filed:

Mar. 06, 2015
Applicant:

Nlt Technologies, Ltd., Kanagawa, JP;

Inventors:

Tetsuroh Asakura, Kanagawa, JP;

Koji Shigemura, Kanagawa, JP;

Assignee:

NLT TECHNOLOGIES, LTD., Kawasaki, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 27/22 (2006.01); B32B 37/00 (2006.01); B32B 37/10 (2006.01); B32B 37/18 (2006.01); B32B 38/18 (2006.01); G02B 27/62 (2006.01); B32B 33/00 (2006.01); B32B 41/00 (2006.01); B32B 37/12 (2006.01);
U.S. Cl.
CPC ...
G02B 27/2214 (2013.01); B32B 33/00 (2013.01); B32B 37/0046 (2013.01); B32B 37/1009 (2013.01); B32B 37/1018 (2013.01); B32B 37/18 (2013.01); B32B 38/1833 (2013.01); B32B 38/1841 (2013.01); G02B 27/62 (2013.01); B32B 37/12 (2013.01); B32B 38/1858 (2013.01); B32B 41/00 (2013.01); B32B 2307/40 (2013.01); B32B 2309/68 (2013.01); B32B 2309/72 (2013.01); B32B 2457/20 (2013.01);
Abstract

To provide a substrate laminating apparatus and a substrate laminating method capable of laminating two substrates highly precisely while achieving low cost and saving space. The substrate laminating apparatus includes an upper-substrate camera group provided to a lower vacuum chamber for capturing an image of an upper substrate fixed to an upper vacuum chamber. The upper-substrate camera group captures images of a first upper-substrate alignment mark and a second upper-substrate alignment mark of the upper substrate fixed to the upper vacuum chamber by actions synchronized with the lower vacuum chamber. Thereby, it is possible to save the space and to lower the cost by reducing the number of mechanical components.


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