The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2018
Filed:
Oct. 23, 2015
Applicant:
Daido Steel Co., Ltd., Nagoya-shi, Aichi, JP;
Inventors:
Assignee:
DAIDO STEEL CO., LTD., Aichi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 1/116 (2015.01); C23C 14/08 (2006.01); C23C 14/06 (2006.01); G06F 3/041 (2006.01); C23C 14/00 (2006.01); C23C 14/18 (2006.01); C23C 28/00 (2006.01);
U.S. Cl.
CPC ...
G02B 1/116 (2013.01); C23C 14/0036 (2013.01); C23C 14/0641 (2013.01); C23C 14/08 (2013.01); C23C 14/087 (2013.01); C23C 14/185 (2013.01); C23C 28/321 (2013.01); C23C 28/34 (2013.01); C23C 28/345 (2013.01); G06F 3/041 (2013.01); G06F 2203/04103 (2013.01);
Abstract
The present invention relates to a laminated body containing at least (a) a transparent substrate, (b) a first metal layer that is overlaid on the substrate and forms an electrode, and (c) a second metal layer having a light reflectance of 20% or less, in which the second metal layer is overlaid on the surface of the first metal layer opposite to the substrate or between the first metal layer and the substrate by sputtering using a reactive sputtering gas, and the second metal layer is constituted by an oxide or nitride of a Cu alloy containing at least Zn.