The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2018

Filed:

Mar. 11, 2014
Applicant:

Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;

Inventor:

Tomoyuki Hirayama, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/00 (2006.01); G02B 6/10 (2006.01); G02B 1/04 (2006.01); C08G 59/20 (2006.01); C08G 59/68 (2006.01); G02B 6/138 (2006.01); G03F 7/00 (2006.01); G03F 7/039 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
G02B 1/046 (2013.01); C08G 59/20 (2013.01); C08G 59/68 (2013.01); G02B 1/045 (2013.01); G02B 6/138 (2013.01); G03F 7/0005 (2013.01); G03F 7/039 (2013.01); H05K 1/0274 (2013.01); H05K 1/0326 (2013.01); H05K 1/0393 (2013.01);
Abstract

The present invention provides a photosensitive epoxy resin composition for an optical waveguide. The photosensitive epoxy resin composition contains: (A) a cresol novolak polyfunctional epoxy resin, the cresol novolak polyfunctional epoxy resin not being fluorene skeleton-containing epoxy resins (C) and (D); (B) a solid bisphenol-A epoxy resin; (C) a solid fluorene skeleton-containing epoxy resin; (D) a liquid fluorene skeleton-containing epoxy resin; and (E) a cationic curing initiator, wherein the components (A) to (E) are each present in a proportion falling within a predetermined range based on the amount of the overall epoxy resin component. Therefore, the photosensitive epoxy resin composition is excellent in coatability, patterning resolution, roll-to-roll process adaptability and the like, and has higher transparency and heat resistance.


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