The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2018

Filed:

Feb. 09, 2011
Applicants:

Robert Hendrik Catharina Janssen, Beek, NL;

Hans Klaas Van Dijk, Sittard, NL;

Inventors:
Assignee:

DSM IP ASSETS B.V., Heerlen, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 29/70 (2015.01); F21K 9/90 (2016.01); F21V 15/01 (2006.01); F21V 29/00 (2015.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21V 29/70 (2015.01); F21K 9/90 (2013.01); F21V 15/01 (2013.01); F21V 29/004 (2013.01); F21Y 2115/10 (2016.08);
Abstract

The invention relates to a LED lighting device LLD) comprising a heat spreader, having a front side and a back side; LEDs mounted on a PCB positioned on the front side of the heat spreader; a reflector or lens covering the LEDs; a socket for being received by an electrical supply system; optionally a base part; electronic driver components mounted on the back side of the heat spreader or inside the socket or base part; electrical leads or wiring system connecting the socket, the electronic driver components and the heat spreader; and a housing, optionally encapsulating the electronic components and the electrical leads or wiring system, being in thermally conductive contact with the heat spreader, wherein the housing is made of an thermally conductive, electrically conductive plastic material (TC/EC-material-A), covered with a protection layer consisting of an electrically insulating material (EI-material-B), on the outside of the housing.


Find Patent Forward Citations

Loading…