The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2018
Filed:
Jan. 15, 2016
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Inventor:
Koji Motomura, Osaka, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); C09J 9/02 (2006.01); H05K 3/32 (2006.01); C09J 163/00 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H05K 3/323 (2013.01); C09J 163/00 (2013.01); C09J 2201/602 (2013.01); C09J 2201/606 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); C09J 2463/00 (2013.01); C09J 2481/00 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81201 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83201 (2013.01); H05K 1/141 (2013.01); H05K 2201/0278 (2013.01); H05K 2201/0293 (2013.01); H05K 2201/068 (2013.01); H05K 2201/10674 (2013.01); H05K 2201/10727 (2013.01);
Abstract
A film material includes a substrate and a film layer arranged on one main surface of the substrate. The film layer contains a fibrous first resin and a thermosetting second resin in an uncured or semi-cured state, and a linear expansion coefficient CF of the first resin is smaller than a linear expansion coefficient CR of the second resin in cured state.