The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2018

Filed:

Oct. 14, 2016
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Takayuki Kusunoki, Annaka, JP;

Yuusuke Takamizawa, Annaka, JP;

Yoshihira Hamamoto, Annaka, JP;

Kinya Kodama, Annaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 83/06 (2006.01); C08J 5/18 (2006.01); H01L 33/50 (2010.01); H01L 33/54 (2010.01); C09D 183/08 (2006.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
C08L 83/06 (2013.01); C08J 5/18 (2013.01); C09D 183/08 (2013.01); H01L 33/502 (2013.01); H01L 33/507 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); C08J 2383/04 (2013.01); C08J 2483/06 (2013.01); C08J 2483/07 (2013.01); C08L 2205/02 (2013.01); C08L 2205/03 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0041 (2013.01);
Abstract

An addition/condensation curable silicone resin sheet comprising (A) an organopolysiloxane containing at least two silicon-bonded alkenyl groups and at least two silicon-bonded alkoxy or hydroxyl groups, (B) an organopolysiloxane containing at least two silicon-bonded hydrogen atoms and at least two silicon-bonded alkoxy or hydroxyl groups, (C) an organopolysiloxane containing at least two silicon atoms having two alkoxy or hydroxyl groups and one hydrogen atom on a common silicon atom, and (D) a hydrosilylation catalyst is plastic and solid or semisolid at normal temperature. The silicone resin sheet is easy to work, effective to cure, and likely to form a cured layer around an LED chip.


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