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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9902851 B1

PDFFull Text
Date of Patent:
Feb. 27, 2018

Filed:

Oct. 18, 2013

Resin composition, prepreg, laminate, and printed wiring board

Applicant:

Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;

Inventors:

Hiroshi Takahashi, Tokyo, JP;

Tomo Chiba, Tokyo, JP;

Nobuyoshi Ohnishi, Tokyo, JP;

Katsuya Tomizawa, Tokyo, JP;

Keisuke Takada, Tokyo, JP;

Eisuke Shiga, Tokyo, JP;

Takaaki Ogashiwa, Tokyo, JP;

Assignee:

MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Marc Zimmer

Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08G 59/62 (2006.01); H05K 1/03 (2006.01); C08J 5/24 (2006.01); C08K 3/34 (2006.01); C08K 3/36 (2006.01); B32B 15/092 (2006.01); B32B 27/06 (2006.01); B32B 27/28 (2006.01); B32B 27/38 (2006.01); B32B 5/02 (2006.01); B32B 15/14 (2006.01); C08L 83/06 (2006.01); C08G 77/04 (2006.01); C08G 77/14 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); B32B 5/024 (2013.01); B32B 15/092 (2013.01); B32B 15/14 (2013.01); B32B 27/06 (2013.01); B32B 27/28 (2013.01); B32B 27/283 (2013.01); B32B 27/38 (2013.01); C08G 59/621 (2013.01); C08J 5/24 (2013.01); C08K 3/34 (2013.01); C08K 3/36 (2013.01); C08L 83/06 (2013.01); H05K 1/0353 (2013.01); B32B 2250/02 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2307/202 (2013.01); B32B 2307/206 (2013.01); B32B 2307/306 (2013.01); B32B 2457/08 (2013.01); C08G 77/045 (2013.01); C08G 77/14 (2013.01); C08J 2363/00 (2013.01); C08J 2365/00 (2013.01); C08J 2383/06 (2013.01); C08J 2463/00 (2013.01); C08J 2479/04 (2013.01); C08J 2483/06 (2013.01); C08L 2201/08 (2013.01); C08L 2203/20 (2013.01); C08L 2205/03 (2013.01); C08L 2205/035 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0162 (2013.01); H05K 2201/029 (2013.01); H05K 2201/0209 (2013.01); Y10T 428/31511 (2015.04); Y10T 428/31529 (2015.04);
Abstract

A resin composition containing a cyclic epoxy-modified silicone compound (A) represented by formula (1), a cyanic acid ester compound (B) and/or a phenol resin (C) and an inorganic filler (D): wherein Reach independently represent an organic group having an epoxy group; Reach independently represent a substituted or unsubstituted monovalent hydrocarbon group; x represents an integer of 0 to 2; and y represents an integer of 1 to 6; and the siloxane unit marked with x and the siloxane unit marked with y are arranged mutually at random.

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