The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2018
Filed:
Mar. 05, 2015
Sekisui Plastics Co., Ltd., Osaka, JP;
Hiroki Oowaki, Shiga, JP;
Yuichi Gondoh, Nara, JP;
SEKISUI PLASTICS CO., LTD., Osaka, JP;
Abstract
High-density polyethylene mixed resin particles used as seed particles during seed polymerization, wherein said seed particles contain a mixed resin of 100 parts by weight of high-density polyethylene and 20 to 100 parts by weight of an ethylene copolymer; said high-density polyethylene has a density of 935 to 960 kg/mand a softening temperature of 115 to 130° C.; said ethylene copolymer is a copolymer of an ester-based monomer selected from an acrylic acid alkyl ester and an aliphatic saturated monocarboxylic acid vinyl, and etylene, contains 1 to 20% by weight of an ester-based monomer-derived component, and has a softening temperature of 75 to 110° C.; said acrylic acid alkyl ester is selected from methyl acrylate and ethyl acrylate; and said aliphatic saturated monocarboxylic acid vinyl is selected from vinyl acetate and vinyl propionate.