The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2018
Filed:
Dec. 26, 2014
Samsung Sdi Co., Ltd., Yongin-si, KR;
So Young Kwon, Uiwang-si, KR;
Jin Kyu Kim, Uiwang-si, KR;
Young Sub Jin, Uiwang-si, KR;
Joon Sung Kim, Uiwang-si, KR;
Ki Yon Lee, Uiwang-si, KR;
Suk Min Jun, Uiwang-si, KR;
Lotte Advanced Materials Co., Ltd., Yeosu-si, KR;
Abstract
A copolymerized polyamide resin includes a polymer of a monomer mixture comprising a dicarboxylic acid component comprising adipic acid and a dicarboxylic acid represented by Formula 1, wherein each Ris independently a Cto Calkyl group and a is an integer from 0 to 4, and a diamine component comprising m-xylene diamine and a diamine represented by Formula 2, wherein A is a single bond or a Cto Chydrocarbon group, Rand Rare each independently a Cto Calkyl group, and b and c are each independently an integer from 0 to 4, wherein the copolymerized polyamide resin has a difference between a melting temperature (Tm) and a crystallization temperature (Tc) of about 50° C. or more. The copolymerized polyamide resin may have excellent heat resistance and reduced or no gel generation and yellowing phenomenon in a molding process.