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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9902798 B1

PDFFull Text
Date of Patent:
Feb. 27, 2018

Filed:

Feb. 21, 2014

Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board

Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Yutaka Satou, Ichihara, JP;

Ayumi Takahashi, Ichihara, JP;

Gensuke Akimoto, Ichihara, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorneys:

Locke Lord LLP

James E. Armstrong, IV

Nicholas J. DiCeglie, Jr.

Primary Examiner:

Ramsey E Zacharia

Int. Cl.
CPC ...
C08G 8/20 (2006.01); C08G 59/62 (2006.01); H01L 23/29 (2006.01); H05K 1/03 (2006.01); C07C 39/15 (2006.01); C08G 8/02 (2006.01); C08G 61/02 (2006.01); C08L 61/16 (2006.01); C08K 3/04 (2006.01); C08K 7/18 (2006.01); H05K 1/09 (2006.01); C09D 163/00 (2006.01); C08L 65/00 (2006.01);
U.S. Cl.
CPC ...
C08G 8/02 (2013.01); C07C 39/15 (2013.01); C08G 59/621 (2013.01); C08G 61/02 (2013.01); C08K 3/04 (2013.01); C08K 7/18 (2013.01); C08L 61/16 (2013.01); C09D 163/00 (2013.01); H01L 23/295 (2013.01); H05K 1/0366 (2013.01); H05K 1/09 (2013.01); C08L 65/00 (2013.01); H01L 2924/0002 (2013.01);
Abstract

There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The phenolic resin contains a binuclear compound (X) represented by the following Structural Formula (I), and a trinuclear compound (Y) represented by the following Structural Formula (II) as essential components: wherein each of j and k is 1 or 2, and at least one of j and k is 2; wherein each of l, m and n is 1 or 2, and at least one of l, m, and n is 2.

Find Patent Forward Citations

Satou, Yutaka. (2018). Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board (U.S. Patent No. 9902798). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9902798

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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