The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2018

Filed:

May. 16, 2016
Applicant:

Foresee Technology Corp.., Taoyuan, TW;

Inventors:

Chien-Chan Chen, Taoyuan, TW;

Yi-Der Liang, Taoyuan, TW;

Shiao-Yi Lin, Taoyuan, TW;

Cheng-Kuang Yang, Taoyuan, TW;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01); H04R 19/00 (2006.01); H04R 19/04 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0054 (2013.01); B81C 1/00246 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0118 (2013.01); B81B 2203/0361 (2013.01); B81B 2207/015 (2013.01); B81B 2207/07 (2013.01); B81C 2201/013 (2013.01); B81C 2201/053 (2013.01); B81C 2203/0714 (2013.01); B81C 2203/0735 (2013.01);
Abstract

A support pillar is formed under a movable film for support. The support pillar includes a plurality of first metal micropillars, a base metal connection pillar layer and a first oxide encapsulation layer. The first metal micropillars are formed under the movable film and conductively connected to the movable film via metal connection. The base metal connection pillar layer is formed under the first metal micropillars and conductively connected to the first metal micropillars. The first oxide encapsulation layer fully or partially encapsulates the first metal micropillars to insulate the first metal micropillars from air, and shape the support pillar into a column shape.


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