The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2018

Filed:

Sep. 13, 2016
Applicant:

Electronics and Telecommunications Research Institute, Daejeon, KR;

Inventors:

Sae Kyoung Kang, Daejeon-si, KR;

Heuk Park, Daejeon-si, KR;

Hwan Seok Chung, Daejeon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); H05K 1/025 (2013.01); H05K 1/116 (2013.01); H05K 3/28 (2013.01); H05K 3/3447 (2013.01); H05K 2201/10121 (2013.01);
Abstract

A flexible printed circuit board (FPCB) for an optical module includes: a signal via pad connected with a signal lead pin of the optical module; a ground layer spaced apart from the signal via pad; an isolation gap formed between the signal via pad and the ground layer; and a protective layer which is formed at a portion that comprises the isolation gap, and which, when connected with the signal via pad, compensates for parasitic inductance caused by a protruding signal lead pin.


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