The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2018
Filed:
Jun. 02, 2016
Applicant:
Finisar Corporation, Sunnyvale, CA (US);
Inventors:
Wenhua Ling, San Jose, CA (US);
Yan Yang Zhao, Fremont, CA (US);
Yongsheng Liu, San Jose, CA (US);
Yuheng Lee, San Jose, CA (US);
Assignee:
FINISAR CORPORATION, Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); H05K 1/14 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/03 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/021 (2013.01); G02B 6/428 (2013.01); G02B 6/4246 (2013.01); G02B 6/4269 (2013.01); G02B 6/4272 (2013.01); H05K 1/0204 (2013.01); H05K 1/0274 (2013.01); H05K 1/0298 (2013.01); H05K 1/0306 (2013.01); H05K 1/115 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H05K 2201/041 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/10121 (2013.01);
Abstract
In one example embodiment, an optoelectronic assembly includes a multilayer ceramic substrate that includes multiple ceramic layers and a via disposed through at least one of the ceramic layers. The via may be formed from a conductive material that is configured to communicate a signal through the via. The multilayer ceramic substrate may be configured to dissipate heat emitted by an electronic component coupled to the multilayer ceramic substrate.