The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2018

Filed:

Apr. 27, 2015
Applicants:

Autonetworks Technologies, Ltd., Yokkaichi, Mie, JP;

Sumitomo Wiring Systems, Ltd., Yokkaichi, Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Takehito Kobayashi, Mie, JP;

Yoshikazu Sasaki, Mie, JP;

Shigeki Yamane, Mie, JP;

Tomohiro Ooi, Mie, JP;

Yukinori Kita, Mie, JP;

Assignees:

AutoNetworks Technologies, Ltd., Yokkaichi, Mie, JP;

Sumitomo Wiring Systems, Ltd., Yokkaichi, Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/228 (2006.01); H01G 9/10 (2006.01); H05K 5/03 (2006.01); H02G 3/16 (2006.01); H05K 7/06 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H02G 3/16 (2013.01); H05K 1/0203 (2013.01); H05K 1/181 (2013.01); H05K 7/06 (2013.01); H05K 7/20854 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10272 (2013.01);
Abstract

Provided is a circuit assembly that includes a circuit board that has a connection opening, a plurality of busbars that are laminated on one surface side of the circuit board via an adhesive sheet, a coil that has a main portion and a plurality of lead terminals, the coil being arranged on the other surface side of the circuit board by the lead terminals being connected to the plurality of busbars that are exposed through the connection opening, and a heatsink that is laminated on a side of the plurality of busbars that is opposite to the circuit board via an adhesive agent. The adhesive sheet has sheet openings through which the plurality of busbars are exposed and the plurality of lead terminals are connected to the plurality of busbars, the adhesive sheet covering a gap between the plurality of busbars, the gap being located in the connection opening.


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