The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2018
Filed:
Feb. 16, 2017
Advanced Optoelectronic Technology, Inc., Hsinchu Hsien, TW;
Yau-Tzu Jang, Hsinchu, TW;
Yu-Liang Huang, Hsinchu, TW;
Wen-Liang Tseng, Hsinchu, TW;
Pin-Chuan Chen, Hsinchu, TW;
Lung-Hsin Chen, Hsinchu, TW;
Hsing-Fen Lo, Hsinchu, TW;
Chao-Hsiung Chang, Hsinchu, TW;
Che-Hsang Huang, Hsinchu, TW;
Yu-Lun Hsieh, Hsinchu, TW;
ADVANCED OPTOELECTRONIC TECHNOLOGY, INC., Hsinchu Hsien, TW;
Abstract
A lead frame for an LED package includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes separated first and second connecting surfaces. Top surfaces of the bonding electrode, the first connecting electrode, and the second connecting electrode are exposed, and support and electrically connect with light emitting chips. LED packages can be mounted on the lead frame and electrically connect with each other. The conductive layout of the lead frame further permits installation of a zener diode which can be connected to the LED packages in series or in parallel.