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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9899583 B1

PDFFull Text
Date of Patent:
Feb. 20, 2018

Filed:

Dec. 08, 2016

Lead frame for mounting led elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Applicant:

Dai Nippon Printing Co., Ltd., Tokyo, JP;

Inventors:

Kazunori Oda, Kawaguchi, JP;

Masaki Yazaki, Fujimino, JP;

Assignee:

DAI NIPPON PRINTING CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Tu-Tu Ho

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 33/62 (2010.01); F21V 7/22 (2018.01); F21V 23/00 (2015.01); H01L 33/48 (2010.01); F21V 21/00 (2006.01); H01L 33/52 (2010.01); H01L 33/60 (2010.01); H01L 23/482 (2006.01); H01L 33/54 (2010.01); H01L 33/56 (2010.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); F21Y 101/00 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); F21V 7/22 (2013.01); F21V 21/00 (2013.01); F21V 23/005 (2013.01); H01L 23/4824 (2013.01); H01L 23/495 (2013.01); H01L 23/49503 (2013.01); H01L 23/49517 (2013.01); H01L 23/562 (2013.01); H01L 24/97 (2013.01); H01L 33/48 (2013.01); H01L 33/486 (2013.01); H01L 33/52 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); F21Y 2101/00 (2013.01); F21Y 2115/10 (2016.08); H01L 23/3142 (2013.01); H01L 23/49548 (2013.01); H01L 23/49582 (2013.01); H01L 23/49861 (2013.01); H01L 24/16 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/48639 (2013.01); H01L 2224/85439 (2013.01); H01L 2224/97 (2013.01); H01L 2924/0104 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/10162 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/181 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a dicing region. The die pad in one package region and the lead section in another package region upward or downward adjacent to the package region of interest are connected to each other by an inclined reinforcement piece positioned in the dicing region.

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