The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2018
Filed:
Aug. 14, 2015
Applicant:
Lumileds Llc, San Jose, CA (US);
Inventors:
Decai Sun, Sunnyvale, CA (US);
Charlene Sun, Pleasanton, CA (US);
Oleg Shchekin, San Francisco, CA (US);
Assignee:
Lumileds LLC, San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/08 (2010.01); H01L 33/36 (2010.01); H01L 33/38 (2010.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 21/56 (2006.01); H01L 33/52 (2010.01); H01L 33/44 (2010.01);
U.S. Cl.
CPC ...
H01L 33/54 (2013.01); H01L 21/563 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01); H01L 33/0079 (2013.01); H01L 33/44 (2013.01); H01L 33/52 (2013.01); H01L 2224/73203 (2013.01); H01L 2924/01079 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01);
Abstract
A process for preparing a semiconductor structure for mounting to a carrier is disclosed. The process involves causing a support material to substantially fill a void defined by surfaces formed in the semiconductor structure and causing the support material to solidify sufficiently to support the semiconductor structure when mounted to the carrier.