The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2018

Filed:

Jul. 21, 2015
Applicant:

Helmholtz-zentrum Berlin Fuer Materialien Und Energie Gmbh, Berlin, DE;

Inventors:

Sven Ring, Berlin, DE;

Moshe Weizman, Berlin, DE;

Holger Rhein, Berlin, DE;

Christof Schultz, Berlin, DE;

Frank Fink, Potsdam, DE;

Stefan Gall, Berlin, DE;

Rutger Schlatmann, Berlin, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 31/061 (2012.01); H01L 31/18 (2006.01); H01L 31/0445 (2014.01); H01L 31/0216 (2014.01); H01L 31/0224 (2006.01); H01L 31/0376 (2006.01); H01L 31/0368 (2006.01);
U.S. Cl.
CPC ...
H01L 31/061 (2013.01); H01L 31/02167 (2013.01); H01L 31/022475 (2013.01); H01L 31/022483 (2013.01); H01L 31/03682 (2013.01); H01L 31/03762 (2013.01); H01L 31/0445 (2014.12); H01L 31/1864 (2013.01); H01L 31/1868 (2013.01); H01L 31/1872 (2013.01); H01L 31/1884 (2013.01);
Abstract

A method for producing a rear-side contact system for a silicon thin-film solar cell having a pn junction formed from a silicon absorber layer and an emitter layer includes applying an organic insulation layer to the emitter layer; producing contact holes in the insulation layer as far as the absorber layer and the emitter layer; subsequently insulating the contact holes; subsequently applying a low-melting metal layer to form n and p contacts in the contact holes; separating the metal layer into n-contacting and p-contacting regions by laser-cutting; before applying the organic insulation layer to the emitter layer, applying a TCO layer; producing holes for contacts for the silicon absorber layer in the organic insulation; and subsequently selectively doping the produced holes for the contacts as far as the silicon absorber layer.


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