The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2018

Filed:

Jul. 02, 2015
Applicant:

Infineon Technologies Americas Corp., El Segundo, CA (US);

Inventors:

Russell Turner, Monmouthshire, GB;

Rajeev Krishna Vytla, Los Angeles, CA (US);

Luther-King Ngwendson, Newport, GB;

Nicholas Limburn, Newport, GB;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/43 (2006.01); H01L 29/10 (2006.01); H01L 29/06 (2006.01); H01L 29/40 (2006.01); H01L 29/66 (2006.01); H01L 29/739 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1095 (2013.01); H01L 29/0619 (2013.01); H01L 29/0623 (2013.01); H01L 29/0649 (2013.01); H01L 29/0696 (2013.01); H01L 29/402 (2013.01); H01L 29/408 (2013.01); H01L 29/66333 (2013.01); H01L 29/66348 (2013.01); H01L 29/7395 (2013.01); H01L 29/7397 (2013.01);
Abstract

An edge termination structure is disclosed. The edge termination structure includes an active cell in a semiconductor wafer, an edge termination region adjacent the active cell in the semiconductor wafer, where the edge termination region includes a recessed field oxide region and a termination charge region below the recessed field oxide region. The recessed field oxide region may be thermally grown in a recess in the semiconductor wafer. A top surface of the recessed field oxide region is substantially coplanar with a top surface of the semiconductor wafer. The active cell may include at least one insulated-gate bipolar transistor surrounded by the edge termination region in the semiconductor wafer. The termination charge region has a conductivity type opposite of that of the semiconductor wafer. The termination charge region is adjacent to at least one guard ring in the semiconductor wafer.


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