The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2018

Filed:

Jun. 20, 2017
Applicant:

Advanced Optoelectronic Technology, Inc., Hsinchu, Hsien, TW;

Inventors:

Chin-Fu Cheng, Hsinchu Hsien, TW;

Chih-Hsun Ke, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/20 (2010.01); H01L 25/13 (2006.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/13 (2013.01); H01L 33/20 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A vertically shallow LED package structure includes at least one LED chip, a package layer, and a first cover layer. Each LED chip includes a first bottom surface. The package layer covers and wraps around each LED chip, and can absorb light emitted by each LED chip and emit light with a different preset wavelength. The package layer includes a second bottom surface facing the first bottom surface, a first side surface perpendicular to the second bottom surface, and a convex surface interconnecting the second bottom surface and the first side surface. The convex surface protrudes away from the LED chip. The convex surface can reflect the light with the preset wavelength towards the first side surface. The first cover layer covers the package layer and exposes the first side surface.


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