The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2018

Filed:

Apr. 04, 2014
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Takanobu Kajihara, Tokyo, JP;

Daisuke Nakashima, Tokyo, JP;

Katsuhiko Omae, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/433 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/3142 (2013.01); H01L 23/4334 (2013.01); H01L 23/4952 (2013.01); H01L 23/49513 (2013.01); H01L 23/49524 (2013.01); H01L 23/49548 (2013.01); H01L 23/49582 (2013.01); H01L 24/36 (2013.01); H01L 24/40 (2013.01); H01L 23/3107 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18301 (2013.01);
Abstract

A scale-like portion wherein metal plating is changed into a scale-like form is provided by continuously carrying out laser spot irradiation on a lead frame, the front surface of which is coated with the metal plating. The scale-like portion is disposed in an optional portion of the lead frame, for example, in the vicinity of a gate break mark, in an outer peripheral portion in a region sealed with a molding resin, or around a semiconductor element. The adhesion between the lead frame and the molding resin improves owing to the anchor effect of the scale-like portion, and it is thus possible to suppress the molding resin separating from the lead frame.


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