The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2018
Filed:
Nov. 16, 2016
Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A fan-out semiconductor package includes a redistribution layer, the redistribution layer including a first insulating layer, a first wiring disposed on the first insulating layer, a second insulating layer disposed on the first insulating layer and covering the first wiring, a line via passing through the second insulating layer continuously and connected to the first wiring, and a second wiring disposed on the second insulating layer and connected to the line via; a semiconductor chip disposed on one side of the redistribution layer, and having an electrode pad electrically connected to the first wiring, the second wiring, and the line via; and an encapsulant disposed on the one side of the redistribution layer, and encapsulating the semiconductor chip.