The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2018

Filed:

May. 24, 2016
Applicant:

Beijing Naura Microelectronics Equipment Co., Ltd., Beijing, CN;

Inventors:

Jinrong Zhao, Beijing, CN;

Shaohua Liu, Beijing, CN;

Gang Wei, Beijing, CN;

Yulin Peng, Beijing, CN;

Meng Yang, Beijing, CN;

Yali Fu, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01J 37/32 (2006.01); H01L 29/78 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32715 (2013.01); H01J 37/3211 (2013.01); H01J 37/32183 (2013.01); H01J 37/32816 (2013.01); H01L 21/68714 (2013.01); H01L 29/78 (2013.01);
Abstract

Some embodiments of the present disclosure provide a semiconductor manufacturing apparatus. The semiconductor manufacturing apparatus includes a chamber, a support and a liner. The chamber is configured for plasma processes and includes a chamber wall. The support is configured to hold a wafer in the chamber. The liner is configured to surround the support and includes a top side and a bottom side. The top side is detachably hung on the chamber wait. The bottom side includes gas passages for plasma particles to pass through the liner.


Find Patent Forward Citations

Loading…