The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2018
Filed:
Oct. 31, 2016
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Sung Hee Kim, Suwon-si, KR;
Tae Young Kim, Suwon-si, KR;
Myoung Soon Park, Suwon-si, KR;
Sung Hyun Kim, Suwon-si, KR;
Hye Yeon Cha, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 27/32 (2006.01); H01F 17/00 (2006.01); H01F 27/29 (2006.01); H01F 41/04 (2006.01); H01F 41/12 (2006.01); H01F 17/04 (2006.01);
U.S. Cl.
CPC ...
H01F 27/327 (2013.01); H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 27/292 (2013.01); H01F 41/042 (2013.01); H01F 41/046 (2013.01); H01F 41/127 (2013.01); H01F 2017/048 (2013.01);
Abstract
The present application provides a chip electronic component and a manufacturing method thereof. More particularly, there is provided a chip electronic component including a thin insulating film having a reduced width and extended up to a lower portion of a coil pattern without exposing the coil pattern such that the coil pattern has no direct contact with a magnetic material, thereby preventing a poor waveform at high frequency and increasing inductance.