The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2018
Filed:
May. 17, 2016
Applicant:
Yeh-chiang Technology Corp., Taipei, TW;
Inventor:
Tai-Kuang Wang, Taipei, TW;
Assignee:
YEH-CHIANG TECHNOLOGY CORP., Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/00 (2006.01); F28D 15/04 (2006.01); B23P 15/26 (2006.01);
U.S. Cl.
CPC ...
F28D 15/04 (2013.01); B23P 15/26 (2013.01); B23P 2700/09 (2013.01); F28F 2255/00 (2013.01);
Abstract
A heat conduction device and a manufacturing method thereof are provided. The heat conduction device includes a first plate, a second plate and a capillary structure. The first plate is connected opposite to the second plate. The capillary structure is formed on space between the first plate and the second plate. A vapor channel is formed on a region of the space outside the capillary structure.