The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2018

Filed:

Jun. 14, 2016
Applicant:

Young Lighting Technology Inc., Hsin-Chu, TW;

Inventors:

Chih-Ming Hu, Hsin-Chu, TW;

Shih-Yi Lin, Hsin-Chu, TW;

Ching-Kuo Yeh, Hsin-Chu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 11/00 (2015.01); F21V 7/00 (2006.01); F21V 5/00 (2018.01); F21V 9/00 (2018.01); G02B 6/00 (2006.01); F21V 31/04 (2006.01); H01L 25/075 (2006.01); H01L 33/50 (2010.01); H01L 33/58 (2010.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21V 7/0091 (2013.01); F21V 5/002 (2013.01); F21V 9/00 (2013.01); G02B 6/00 (2013.01); F21V 31/04 (2013.01); F21Y 2115/10 (2016.08); H01L 25/0753 (2013.01); H01L 33/50 (2013.01); H01L 33/58 (2013.01);
Abstract

An optical module and a light source are provided. The light source includes a circuit board, a plurality of light-emitting element chips, a plurality of total reflection elements, an encapsulant, and a plurality of optical wavelength conversion particles. The light-emitting element chips are disposed on the circuit board. Each of the light-emitting element chips is adapted to emit a light beam. The total reflection elements are disposed on the circuit board. Each of the total reflection elements is configured adjacent to one of the light-emitting element chips, a partial light beam of the light beam emitted by the one of the light-emitting element chips enters the total reflection element, and is transmitted in the total reflection element, and emits out from the total reflection element. The encapsulant covers the light-emitting element chips and the total reflection elements. The optical wavelength conversion particles are distributed in the encapsulant.


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