The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2018
Filed:
Jun. 22, 2016
Applicant:
Samsung Sdi Co., Ltd., Yongin-si, Gyeonggi-do, KR;
Inventors:
Dong Hwan Lee, Suwon-si, KR;
Min Gyum Kim, Suwon-si, KR;
So Yoon Kim, Suwon-si, KR;
Woo Chul Na, Suwon-si, KR;
Yoon Man Lee, Suwon-si, KR;
Ji Yoon Cho, Suwon-si, KR;
Ki Hyeok Kwon, Suwon-si, KR;
KyoungChul Bae, Suwon-si, KR;
Eun Jung Lee, Suwon-si, KR;
Joo Young Chung, Suwon-si, KR;
Jin Min Cheon, Suwon-si, KR;
Jin Woo Choi, Suwon-si, KR;
Seung Han, Suwon-si, KR;
Assignee:
SAMSUNG SDI CO., LTD., Yongin-Si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C07C 233/00 (2006.01); C07C 235/00 (2006.01); C07C 237/00 (2006.01); C07F 9/02 (2006.01); C07F 9/54 (2006.01); C09D 163/00 (2006.01); H01L 23/29 (2006.01); C07C 235/64 (2006.01); C08G 59/62 (2006.01); C08G 59/68 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
C07F 9/5442 (2013.01); C07C 235/64 (2013.01); C08G 59/621 (2013.01); C08G 59/688 (2013.01); C09D 163/00 (2013.01); H01L 23/295 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/3512 (2013.01);
Abstract
A phosphonium compound, a method of preparing the same, an epoxy resin composition including the same, and a semiconductor device encapsulated with the same, the compound being represented by Formula 1: