The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2018

Filed:

Jun. 12, 2013
Applicant:

Toyobo Co., Ltd., Osaka-shi, Osaka, JP;

Inventors:

Katsuki Nakase, Otsu, JP;

Tetsuo Okuyama, Otsu, JP;

Toshiyuki Tsuchiya, Otsu, JP;

Satoshi Maeda, Otsu, JP;

Kazuyuki Ouya, Otsu, JP;

Assignee:

Toyobo Co., Ltd., Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/10 (2006.01); B32B 27/28 (2006.01); H05K 3/00 (2006.01); B32B 5/14 (2006.01); B32B 27/08 (2006.01); B32B 37/00 (2006.01); B32B 38/10 (2006.01); B32B 7/06 (2006.01); B32B 27/16 (2006.01); B32B 27/36 (2006.01); B32B 37/12 (2006.01); H05K 1/03 (2006.01); B32B 37/18 (2006.01); B32B 38/04 (2006.01);
U.S. Cl.
CPC ...
B32B 27/281 (2013.01); B32B 5/145 (2013.01); B32B 7/06 (2013.01); B32B 27/08 (2013.01); B32B 27/16 (2013.01); B32B 27/36 (2013.01); B32B 37/0038 (2013.01); B32B 37/12 (2013.01); B32B 38/10 (2013.01); H05K 3/007 (2013.01); B32B 37/182 (2013.01); B32B 38/04 (2013.01); B32B 2250/04 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2307/746 (2013.01); B32B 2307/748 (2013.01); B32B 2310/0831 (2013.01); B32B 2379/08 (2013.01); B32B 2457/00 (2013.01); B32B 2457/08 (2013.01); B32B 2457/14 (2013.01); H05K 1/0346 (2013.01); H05K 2201/0154 (2013.01); Y10T 428/24612 (2015.01);
Abstract

By preparing a polyimide film with a face at the support side and subjected to a surface treatment; subjecting at least one of a face of the support and the face of the polyimide film which are opposite to each other to a patterning treatment using a coupling agent to form a satisfactorily bondable part and an easily releasable part which differ in adhesion/peel strength; subsequently, superposing the support and the polyimide film to be subjected to a pressurizing/heating treatment and to be bonded to each other, subjecting the surface of the polyimide film to an organic alkali treatment; and then, applying a polyamic acid solution free from a slip agent ingredient, drying the coating film and imidizing the film, a layered product having a structure of at least three layers in which at least one layer contains a slip agent material and both surface layers have no slip agent material is produced.


Find Patent Forward Citations

Loading…