The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2018
Filed:
Apr. 16, 2015
Koito Manufacturing Co., Ltd., Tokyo, JP;
Hiroya Ito, Shizuoka, JP;
Koito Manufacturing Co., Ltd., Tokyo, JP;
Abstract
Provided are a two-color molding method, and a two-color molded article capable of suppressing deterioration of the appearance quality which is caused by resin shrinkage or resin deformation in the two-color molding. The two-color molding method includes: molding a first resin portion by a common die and a primary die; and molding a second resin portion integrally with the first resin portion by the common die and a secondary die. An abutting portion is molded on an edge of the first resin portion to protrude toward the secondary die when the first resin portion is molded, and a distal end surface of the abutting portion is maintained to be abutted on a cavity surface or a parting surface of the secondary die when the second resin portion is molded. The deformation of the abutting portion or the first resin portion is suppressed to suitably mold the second resin portion.