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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9895838 B1

PDFFull Text
Expired
Date of Patent:
Feb. 20, 2018

Filed:

May. 17, 2017

Resin mold for nanoimprinting and production method thereof

Applicant:

Soken Chemical & Engineering Co., Ltd., Tokyo, JP;

Inventors:

Hiroko Yamada, Sayama, JP;

Takahide Mizawa, Sayama, JP;

Assignee:

Soken Chemical & Engineering Co., Ltd., Tokyo, JP;

Attorney:

The Webb Law Firm

Primary Examiner:

Alison L Hindenlang

Assistant Examiner:

Jerzi H Moreno Hernandez

Int. Cl.
CPC ...
B29C 59/00 (2006.01); B29C 59/02 (2006.01); B29C 33/40 (2006.01); B29C 33/56 (2006.01); B82Y 40/00 (2011.01); B82Y 10/00 (2011.01); G03F 7/00 (2006.01); B29C 33/42 (2006.01);
U.S. Cl.
CPC ...
B29C 59/005 (2013.01); B29C 33/40 (2013.01); B29C 33/56 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); G03F 7/0002 (2013.01); B29C 33/424 (2013.01); B29C 2033/426 (2013.01); B29C 2059/023 (2013.01);
Abstract

A resin mold for nanoimprinting has a substrate, a resin layer formed upon the substrate and having a depressions and protrusions pattern on a surface, an inorganic substance layer formed of uniform thickness on at least the surface having the depressions and protrusions pattern of the resin layer, and a mold release agent layer formed of uniform thickness on at least the surface having the depressions and protrusions pattern of the inorganic substance layer. The resin of the resin layer includes constituent units derived from an epoxy group-containing unsaturated compound at a concentration of 1 to 50 percent relative to total constituent units, and the epoxy value is 7.0×10to 4.0×10.

Find Patent Forward Citations

Yamada, Hiroko. (2018). Resin mold for nanoimprinting and production method thereof (U.S. Patent No. 9895838). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9895838

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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