The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2018

Filed:

May. 23, 2005
Applicants:

Anthony P. Bergerson, Cedar Hill, TX (US);

Jason L. Hoyle, Mansfield, TX (US);

Inventors:

Anthony P. Bergerson, Cedar Hill, TX (US);

Jason L. Hoyle, Mansfield, TX (US);

Assignee:

Textron Innovations Inc., Providence, RI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B64C 1/00 (2006.01); B29C 43/00 (2006.01); B29C 43/18 (2006.01); B29C 70/88 (2006.01); B32B 1/00 (2006.01); B32B 3/02 (2006.01); B32B 5/26 (2006.01); B32B 7/02 (2006.01); B32B 15/02 (2006.01); B32B 15/06 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); B32B 25/02 (2006.01); B32B 27/18 (2006.01); B29K 101/10 (2006.01); B29K 105/06 (2006.01); B29K 705/00 (2006.01); B29K 705/02 (2006.01); B29K 705/10 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B29C 43/003 (2013.01); B29C 43/18 (2013.01); B29C 70/885 (2013.01); B32B 1/00 (2013.01); B32B 3/02 (2013.01); B32B 5/26 (2013.01); B32B 7/02 (2013.01); B32B 15/02 (2013.01); B32B 15/06 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 25/02 (2013.01); B32B 27/18 (2013.01); B29K 2101/10 (2013.01); B29K 2105/06 (2013.01); B29K 2705/00 (2013.01); B29K 2705/02 (2013.01); B29K 2705/10 (2013.01); B29L 2031/3076 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2260/048 (2013.01); B32B 2262/101 (2013.01); B32B 2262/103 (2013.01); B32B 2307/202 (2013.01); B32B 2457/00 (2013.01); B32B 2605/18 (2013.01); Y02T 50/433 (2013.01);
Abstract

A compression-molded part has a conductive layer embedded in the part during molding of the part. The conductive layer is generally adjacent an outer surface of the part and is preferably formed from a mesh, a foil, a pulled screen, or multiple layers of conductive elements. The part is preferably optimized for use on the exterior of an aircraft for lightning-strike or EMI protection or for use as an antenna. Methods for forming the panels of the invention include placing the conductive layer against a mold surface of a compression mold, then forming the compression-molded part with the conductive layer embedded in the part.


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