The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2018

Filed:

May. 10, 2011
Applicants:

Andrew J Birnbaum, Washington, DC (US);

Alberto Piqué, Crofton, MD (US);

Inventors:

Andrew J Birnbaum, Washington, DC (US);

Alberto Piqué, Crofton, MD (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/00 (2014.01); B23K 26/34 (2014.01); B23K 26/32 (2014.01); B23K 26/324 (2014.01); B23K 26/364 (2014.01); B23K 26/0622 (2014.01); B23K 26/40 (2014.01); B23K 103/12 (2006.01); B23K 101/34 (2006.01); B23K 103/08 (2006.01); B23K 103/00 (2006.01); B23K 103/16 (2006.01);
U.S. Cl.
CPC ...
B23K 26/0063 (2013.01); B23K 26/0006 (2013.01); B23K 26/0093 (2013.01); B23K 26/0624 (2015.10); B23K 26/32 (2013.01); B23K 26/324 (2013.01); B23K 26/34 (2013.01); B23K 26/364 (2015.10); B23K 26/40 (2013.01); B23K 2201/34 (2013.01); B23K 2203/08 (2013.01); B23K 2203/12 (2013.01); B23K 2203/172 (2015.10); B23K 2203/50 (2015.10);
Abstract

In a method of controlled laser deformation, a substrate is provided that is transparent to the laser energy. At least a portion of the substrate is coated with a release layer that absorbs the laser energy. A component to be deformed is attached to the release layer opposed to the substrate. A source of laser energy is directed through the substrate and into a portion of the release layer, which vaporizes the portion of the release layer by absorption of the laser energy, and releases a portion of the component from the substrate. This deforms the portion of the component away from the substrate by the vaporization of the release layer such that at least one edge of the component is no longer in contact with the release layer or substrate, and leaving a second portion of the component still attached to non-vaporized release layer.


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