The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2018

Filed:

Aug. 20, 2015
Applicant:

Corentec Co., Ltd., Chungcheongnam-do, KR;

Inventors:

Doo-Hoon Sun, Seoul, KR;

Yong-Sik Kim, Seoul, KR;

Jung-Sung Kim, Chungcheongnam-do, KR;

Tae-Jin Shin, Chungcheongnam-do, KR;

Byung-Soo Kim, Seoul, KR;

Assignee:

Corentec Co., Ltd., Chungcheongnam-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61F 2/30 (2006.01); A61F 2/32 (2006.01); A61F 2/38 (2006.01);
U.S. Cl.
CPC ...
A61F 2/3094 (2013.01); A61F 2/30767 (2013.01); A61F 2/32 (2013.01); A61F 2/38 (2013.01); A61F 2002/3093 (2013.01); A61F 2002/3097 (2013.01); A61F 2002/30769 (2013.01); A61F 2310/00023 (2013.01); A61F 2310/00029 (2013.01);
Abstract

Disclosed herein is a method for manufacturing an implant that is to be surgically inserted in vivo, such as in an artificial knee or artificial hip. According to the method, the porous layer contains pores that have a vertically curved shape with a radius of 100 to 300 μm, thus allowing a bond to grow into the pores to enhance bond adhesion, and an interconnection space is formed between turning points in adjacent unit base layers to increase the ratio of interconnection between pores, whereby bones are allowed to grow into the pores to increase bone adhesion.


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