The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2018
Filed:
Aug. 05, 2016
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Ji-Yong Kim, Suwon-si, KR;
Yu-Sung Kim, Seoul, KR;
Chung-Hyun Ryu, Hwaseong-si, KR;
Sung-Ki Lee, Seoul, KR;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28D 21/00 (2006.01); F28F 3/04 (2006.01); F28F 27/00 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20409 (2013.01); F28D 21/00 (2013.01); F28F 3/04 (2013.01); F28F 27/00 (2013.01); F28D 2021/0029 (2013.01); F28F 2215/04 (2013.01);
Abstract
A heat sink for a memory module includes a thermally conductive base plate configured to be mounted to a module board underneath the base plate, a plurality of radiation fins protruding upwardly from the base plate, and a pocket cover extending upwardly from an opening that is formed in the base plate to be positioned corresponding to a passive device on the module board, and covering the passive device that protrudes through the opening.