The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2018
Filed:
Jun. 24, 2014
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Shin Akasaka, Kanagawa, JP;
Satoshi Kumon, Tokyo, JP;
Kentarou Satou, Kanagawa, JP;
Yuki Oishi, Kanagawa, JP;
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/04 (2012.01); H05K 3/26 (2006.01); H05K 3/00 (2006.01); G06F 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 3/26 (2013.01); B24B 37/042 (2013.01); G06F 1/16 (2013.01); H05K 3/007 (2013.01); H05K 3/0044 (2013.01); H05K 3/0055 (2013.01); H05K 2203/016 (2013.01);
Abstract
There is provided a method of manufacturing a substrate, the method including: polishing a surface of a material substrate; and forming a penalization film on the surface of the material substrate alter the polishing of the surface of the material substrate.