The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2018
Filed:
May. 28, 2014
Samsung Electro-mechanics Co., Ltd., Suwon, KR;
Ic Seob Kim, Suwon, KR;
Soo Hwan Son, Suwon, KR;
Yu Jin Choi, Suwon, KR;
Ho Yoon Kim, Suwon, KR;
Myeong Gi Kim, Suwon, KR;
So Yeon Song, Suwon, KR;
Min Kyoung Cheon, Suwon, KR;
Byeong Cheol Moon, Suwon, KR;
Young Il Lee, Suwon, KR;
SAMSUNG ELECTRO-MECHANICS CO, LTD., Suwon-si, Gyeonggi-Do, KR;
Abstract
A multilayer electronic component, a manufacturing method thereof, and a board having the same. The multilayer electronic component includes a plurality of magnetic metal layers, an internal conductive layer formed on the magnetic metal layer, an upper and lower cover layers formed on and below an active part including the plurality of magnetic metal layers and internal conductive layer. The multilayer electronic component may have excellent DC bias characteristics by using a magnetic metal material, implement low direction resistance (Rdc) by increasing a cross-sectional area of an internal coil, and secure high magnetic permeability while decreasing a core loss of the magnetic metal material to thereby improve efficiency characteristic.