The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

May. 12, 2015
Applicant:

Sumitomo Electric Printed Circuits, Inc., Koka-shi, Shiga, JP;

Inventors:

Kousuke Miura, Shiga, JP;

Satoshi Kiya, Shiga, JP;

Sumito Uehara, Shiga, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 1/0313 (2013.01); H05K 1/09 (2013.01); H05K 3/4084 (2013.01); H05K 3/4611 (2013.01); H05K 3/4661 (2013.01); H05K 2201/09509 (2013.01); H05K 2203/072 (2013.01);
Abstract

An object of the present invention is to provide a printed wiring board in which conductive layers formed on two surfaces of a base layer that contains a fluororesin as a main component are reliably connected to each other through a via-hole. A printed wiring board according to an embodiment of the present invention includes a base layer containing a fluororesin as a main component, a first conductive layer stacked on one surface of the base layer, a second conductive layer stacked on the other surface of the base layer, and a via-hole that is formed along a connection hole penetrating the base layer and at least one of the first conductive layer and the second conductive layer in a thickness direction and that electrically connects the first conductive layer and the second conductive layer to each other. At least a part of an inner circumferential surface of the base layer in the connection hole has a pre-treated surface having a content ratio of oxygen atoms or nitrogen atoms of 0.2 atomic percent or more.


Find Patent Forward Citations

Loading…