The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2018
Filed:
Aug. 17, 2015
Applicant:
Ngk Insulators, Ltd., Aichi-prefecture, JP;
Inventors:
Tatsuro Takagaki, Nagoya, JP;
Yasunori Iwasaki, Kitanagoya, JP;
Sugio Miyazawa, Kasugai, JP;
Akiyoshi Ide, Kasugai, JP;
Hirokazu Nakanishi, Nagoya, JP;
Assignee:
NGK INSULATORS, LTD., Aichi-prefecture, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/11 (2006.01); C04B 35/119 (2006.01); H01B 3/12 (2006.01); C04B 35/111 (2006.01); H05K 3/00 (2006.01); H01B 17/56 (2006.01); C04B 35/634 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); C04B 35/111 (2013.01); C04B 35/119 (2013.01); C04B 35/634 (2013.01); H01B 3/12 (2013.01); H01B 17/56 (2013.01); H05K 1/03 (2013.01); H05K 1/0306 (2013.01); H05K 3/00 (2013.01); H05K 3/0029 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3217 (2013.01); C04B 2235/3225 (2013.01); C04B 2235/3244 (2013.01); C04B 2235/3281 (2013.01); C04B 2235/3418 (2013.01); C04B 2235/606 (2013.01); C04B 2235/6023 (2013.01); C04B 2235/612 (2013.01); C04B 2235/6582 (2013.01); C04B 2235/662 (2013.01); C04B 2235/72 (2013.01); C04B 2235/77 (2013.01); C04B 2235/786 (2013.01); C04B 2235/95 (2013.01); H05K 3/0014 (2013.01); H05K 2201/09009 (2013.01); Y10T 428/24273 (2015.01);
Abstract
It is provided an insulating substrate including through holesfor conductors arranged in the insulating substrate. A thickness of the insulating substrate is 25 to 300 μm , and a diameter of the through hole is 20 to 100 μm . The insulating substrate is composed of an alumina sintered body. A relative density and an average grain size of the alumina sintered body is 99.5 percent or higher and 2 to 50 μm , respectively.