The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2018
Filed:
Aug. 29, 2014
Applicant:
Tyco Electronics Japan G.k., Kanagawa, JP;
Inventor:
Takeshi Kimura, Kanagawa-ken, JP;
Assignee:
Tyco Electronics Japan G.K., Kanagawa-ken, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H05K 7/10 (2006.01); H05K 7/12 (2006.01); H05K 1/09 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); H01G 4/005 (2006.01); H05K 1/16 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0284 (2013.01); H01G 4/005 (2013.01); H01G 4/30 (2013.01); H05K 1/0298 (2013.01); H05K 3/4614 (2013.01); H05K 1/162 (2013.01); H05K 3/0014 (2013.01); H05K 2201/042 (2013.01); H05K 2201/2036 (2013.01);
Abstract
A three-dimensional laminated wiring substrate is provided and includes a plurality of wiring substrates disposed on top of each other. Each of the plurality of wiring substrates includes an insulating film and a conductor pattern. The insulating film is disposed along a surface to provide a three-dimensional surface. The conductor pattern is disposed on and extending along the three-dimensional surface.