The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

Feb. 03, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Dylan J. Boday, Tucson, AZ (US);

Joseph Kuczynski, North Port, FL (US);

Robert E. Meyer, III, Rochester, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); C08G 18/02 (2006.01); H01L 23/473 (2006.01); H05K 7/20 (2006.01); H05K 13/00 (2006.01); H01L 23/373 (2006.01); H01L 23/34 (2006.01); H01L 23/36 (2006.01); H01L 23/367 (2006.01); C08G 18/61 (2006.01); H01L 23/46 (2006.01); C08G 77/04 (2006.01); C08G 77/14 (2006.01); F16L 11/04 (2006.01); C08L 83/04 (2006.01); F16L 11/12 (2006.01); C08F 126/06 (2006.01); B29C 71/04 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0272 (2013.01); B29C 71/04 (2013.01); C08F 126/06 (2013.01); C08G 18/02 (2013.01); C08G 18/022 (2013.01); C08G 18/61 (2013.01); C08G 77/04 (2013.01); C08G 77/14 (2013.01); C08L 83/04 (2013.01); F16L 11/04 (2013.01); F16L 11/12 (2013.01); H01L 23/34 (2013.01); H01L 23/36 (2013.01); H01L 23/367 (2013.01); H01L 23/373 (2013.01); H01L 23/3737 (2013.01); H01L 23/46 (2013.01); H01L 23/473 (2013.01); H05K 1/0201 (2013.01); H05K 1/0203 (2013.01); H05K 7/20 (2013.01); H05K 7/20509 (2013.01); H05K 13/00 (2013.01); H01L 2924/00 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/49002 (2015.01); Y10T 29/49826 (2015.01); Y10T 428/1393 (2015.01);
Abstract

A flexible-to-rigid tube is flexible when routed and is then rigidized to increase burst strength. According to the preferred embodiments of the present invention, the flexible-to-rigid tube is included in a cooling plate assembly for transferring heat from electronic components mounted on a circuit board. In one embodiment, the flexible-to-rigid tube (while in a flexible state) includes a polydimethylsiloxane (PDMS) or other silicone containing pendant or terminal epoxy, vinyl and/or acrylate functional groups and an initiator (e.g., a sulfonium salt photoinitiator, a free radical photoinitiator, or a thermal initiator). In another embodiment, triallyl isocyanurate (TAIC) and an initiator are incorporated into a conventional PVC-based tubing material. The flexible-to-rigid tube changes from the flexible state to a rigid state via formation of a cross-linked network upon exposure to actinic radiation or heat.


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