The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

Mar. 17, 2017
Applicant:

Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;

Inventors:

Yosuke Tsunoda, Tachikawa, JP;

Akihiko Fujisaki, Kawasaki, JP;

Jie Wei, Hachioji, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04M 1/00 (2006.01); H05K 1/02 (2006.01); H04M 1/02 (2006.01); H05K 7/20 (2006.01); H05K 9/00 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H04M 1/0202 (2013.01); H05K 1/0212 (2013.01); H05K 7/2039 (2013.01); H05K 7/20336 (2013.01); H05K 9/0024 (2013.01); G06F 1/203 (2013.01); H05K 2201/066 (2013.01);
Abstract

An electronic device includes a board having a first surface on which a heating element is mounted, a heat sink plate disposed to face the first surface of the board, and a heat pipe disposed between the board and the heat sink plate such that one end of the heat pipe is disposed at a position where the one end is in contact with the heating element, and the other end of the heat pipe is disposed to be in contact with the heat sink plate, wherein the heat sink plate has a stacking structure of a first heat sink plate of which a front surface faces the board, and a second heat sink plate disposed on a rear surface of the heat sink plate, and a through hole is formed at a position on the first heat sink plate.


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