The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2018
Filed:
Apr. 19, 2017
Applicant:
Robert Bosch Gmbh, Stuttgart, DE;
Inventors:
Jay Scott Salmon, Portland, OR (US);
Kuldeep Saxena, Sewickley, PA (US);
Assignee:
Robert Bosch GmbH, Stuttgart, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 19/00 (2006.01); H04R 19/04 (2006.01); H04R 1/06 (2006.01);
U.S. Cl.
CPC ...
H04R 19/005 (2013.01); H04R 1/06 (2013.01); H04R 19/04 (2013.01); B81B 2201/0257 (2013.01); B81C 2203/0118 (2013.01); H04R 2201/003 (2013.01); H04R 2231/001 (2013.01);
Abstract
A microelectromechanical system (MEMS) microphone package including a MEMS microphone die configured to sense acoustic pressure and to generate a signal based on the acoustic pressure. An application specific integrated circuit (ASIC) electrically connects to the MEMS microphone die. The MEMS microphone package includes a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms side walls of the MEMS microphone package and is adapted to route electrical connections from the MEMS microphone die and the ASIC to the substrate.