The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

Mar. 13, 2017
Applicant:

Sinbon Electronics Company Ltd., New Taipei, TW;

Inventors:

Yong Cui, New Taipei, TW;

An Li, New Taipei, TW;

Jianbin Tong, New Taipei, TW;

Jian Zuo, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H01R 13/58 (2006.01); H01R 13/6581 (2011.01); H01R 13/66 (2006.01); H01R 4/02 (2006.01);
U.S. Cl.
CPC ...
H01R 13/5845 (2013.01); H01R 4/023 (2013.01); H01R 13/6581 (2013.01); H01R 13/665 (2013.01);
Abstract

A connector of a process field bus decentralized peripherals has a circuit board, two communicating cables each having two core wires and a shielding net layer, the two core wires coated by the shielding net layer, ends of the two core wires electrically connected to the circuit board, an inner shell mounted on the ends of the core wires by injection molding, a shielding layer covering the inner shell and the circuit board, the shielding layer electrically connected to the shielding net layers, and an outer shell mounted on the shielding layer by injection molding. Since the inner shell and the outer shell are formed by injection molding, the circuit board is tightly fixed in the connector. Further, the shielding layer is mounted between the inner shell and the outer shell to protect the circuit board from electromagnetic interference. Therefore, quality of the connector may be improved.


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