Oled package structure and packaging method

Abstract

The present invention provides an OLED package structure and a packaging method. The structure includes a substrate (), a package lid () opposite to the substrate (), an OLED device () located between the substrate () and the package lid () and mounted on the substrate (), a solid resin film () located between the substrate () and the package lid () and arranged on the package lid () to completely cover the OLED device (), an inorganic protective frame () arranged on the substrate () and located outside an outer circumference of the solid resin film (), adhesive () applied on the package lid () to bond the inorganic protective frame () and the package lid () to each other, and fritted glass () arranged outside an outer circumference of the inorganic protective frame () to bond the substrate () and the package lid () to each other. The present invention provides an arrangement where the inorganic protective frame is arranged inboard the fritted glass to effectively strengthen air tightness achieved with the fritted glass. Further, the solid resin film is arranged on the package lid to cover the OLED device so as to further strengthen the capability of the OLED package structure for blocking moisture and also, a gap in the interior of the sealed object is lessened so as to provide a sufficient mechanical strength to extend the lifespan of the OLED device.