The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2018
Filed:
Sep. 24, 2015
Osram Opto Semiconductors Gmbh, Regensburg, DE;
Osram Gmbh, Munich, DE;
Bernd Boehm, Obertraubling, DE;
Daniel Zaspel, Regenstauf, DE;
Stefan Hartauer, Wolfsegg, DE;
Bjoern Hoxhold, Sinzing, DE;
OSRAM Opto Semiconductors GmbH, Regensburg, DE;
OSRAM GmbH, München, DE;
Abstract
The invention provides an optoelectronic semiconductor component and a method for producing an optoelectronic semiconductor component (), comprising the following steps: A) arranging at least one semiconductor chip () on a carrier (), B) applying an electrically insulating photoresist () to a top side () of the carrier () and to the semiconductor chip (), C) curing the photoresist () with a baking step, D) patterning the photoresist () by exposure, F) developing the photoresist (), wherein the photoresist () is removed at least from a radiation penetration surface () of the semiconductor chip (), G) again curing the photoresist () with a baking step, and H) applying an electrically conductive contact layer () to the photoresist (), wherein the electrically conductive contact layer () is in places at a distance (A) from a marginal surface () of the photoresist () which faces towards the semiconductor chip (), wherein the marginal surface () facing towards the semiconductor chip () is exposed in places.